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INTEGRATED CIRCUITS
DATA SHEET
SAA9740H Advanced Auto Control Function (A2CF)
Product specification Supersedes data of 1996 Jan 30 File under Integrated Circuits, IC02 1996 Oct 10
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
FEATURES * One chip full digital Auto Focus (AF), Auto Exposure (AE) and Auto White Balance (AWB) * Possible to use NTSC and PAL CCD with horizontal resolution of 510, 670, 720 or 768 pixels * No manual adjustment * One microprocessor system commonly used with CAMera Digital Signal Processor (CAMDSP) SAA9750H * 8-bit parallel microprocessor interface * LQFP64 package (0.5 mm pitch) * Single 3 V power supply. Auto Focus features * Video AF system * Two windows system (a small centre and large window) * The window size and place are microprocessor controlled * Including 5th order IIR digital high-pass filter * Line peak accumulation in the large window * High-pass filter's output accumulation in one field. Auto White Balance features * Mono colour detection Auto Exposure features * 5 windows accumulation
SAA9740H
* Calculation of white-clip by centre window * Possible to control size and place of the centre windows by the light condition with microprocessor.
* Accumulation of UV data in the corresponding UV quadrant * Green and Magenta elimination gate * Luminance gate for detecting white * UV limiter * White-clip detection/counter. GENERAL DESCRIPTION The Advanced Auto Control Function (A2CF) is to be used for a colour CCD camera system. This IC can realize AWB, AF and AE with a microprocessor. This device consists of an input data selector, a parallel 8-bit microprocessor interface, a data accumulator, a window generator, a command decoder and AWB, AF, AE for each processing block.
QUICK REFERENCE DATA SYMBOL VDD VIL VIH VOL VOH Tamb PARAMETER digital supply voltage (pins 6, 18 and 47) LOW level digital input voltage HIGH level digital input voltage LOW level digital output voltage HIGH level digital output voltage operating ambient temperature 0 0.7VDD - -20 MIN. 2.7 - - - - TYP. 3.0 MAX. 3.3 0.3VDD VDD 0.5 - +70 V V V V V C UNIT
VDD - 0.5 -
ORDERING INFORMATION TYPE NUMBER SAA9740H PACKAGE NAME LQFP64 DESCRIPTION plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm VERSION SOT314-2
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1996 Oct 10
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BLOCK DIAGRAM
Philips Semiconductors
Advanced Auto Control Function (A2CF)
+3 V VDD1 to VDD3 6, 18, 47
HD 34
VD UV_SEL HSYNC 33 35 8 37 WINDOW GENERATOR 36 32 LWDB WDMNT WDINT
SAA9740H
H/V COUNTER
CDS7 to CDS0
57 to 50 8
AUTO FOCUS
18-BIT ADDER
enable signals
31 30
ASTB WRB RDB RSTB
61 to 64, 1 Y7 to Y3 5
AUTO EXPOSURE
PEAK HOLD
29 REGISTER MICROPROCESSOR INTERFACE 28 20 to 27
3
16 to 9 UV7 to UV0 8 AUTO WHITE BALANCE CLK1 CLOCK GENERATOR 40 CLK2OUT 1/2 CLK1 WHITE CLIP CLK1 AMSAL 48 60 7, 19 46, 49, 59 VSS1 to VSS5 58 17 WCLIP 2 TSTIN1 SCAN_T 3 TSTIN2 4
8
IO7 to IO0
39, 38, 45 to 41 7
TSTOUT7 to TSTOUT1
5 TST1
MHA286
TSTIN3
Product specification
SAA9740H
Fig.1 Block diagram.
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
PINNING SYMBOL Y3 TSTIN1 TSTIN2 TSTIN3 TST1 VDD1 VSS1 UV_SEL UV0 UV1 UV2 UV3 UV4 UV5 UV6 UV7 WCLIP VDD2 VSS2 IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0 RSTB RDB WRB ASTB WDINT VD HD HSYNC WDMNT LWDB TSTOUT6 TSTOUT7 CLK2OUT 1996 Oct 10 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 input input input input input - - input input input input input input input input input input - - bidirectional bidirectional bidirectional bidirectional bidirectional bidirectional bidirectional bidirectional input input input input output input input input output output output output output TYPE input pin for test input pin for test input pin for test input pin for test digital supply voltage ground UV select input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) (LSB) UV input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) UV input from SAA9750H (CAMDSP) (MSB) white-clip input from SAA9750H (CAMDSP) digital supply voltage ground microprocessor interface (MSB) microprocessor interface microprocessor interface microprocessor interface microprocessor interface microprocessor interface microprocessor interface microprocessor interface (LSB) system reset read control from microprocessor write control from microprocessor address set from microprocessor window interrupt V-drive signal input H-drive signal input HSYNC input window monitor for test (open-drain) large window for test (open-drain) output pin for test output pin for test output pin of internal clock (open-drain) 4 DESCRIPTION Y input from SAA9750H (CAMDSP) (LSB)
SAA9740H
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
SAA9740H
SYMBOL TSTOUT1 TSTOUT2 TSTOUT3 TSTOUT4 TSTOUT5 VSS3 VDD3 CLK1 VSS4 CDS0 CDS1 CDS2 CDS3 CDS4 CDS5 CDS6 CDS7 SCAN_T VSS5 AMSAL Y7 Y6 Y5 Y4
PIN 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
TYPE output output output output output - - input - input input input input input input input input input - input input input input input output pin for test output pin for test output pin for test output pin for test output pin for test ground digital supply voltage clock ground
DESCRIPTION
CDS input from ADC (LSB) CDS input from ADC CDS input from ADC CDS input from ADC CDS input from ADC CDS input from ADC CDS input from ADC CDS input from ADC (MSB) test control for scan test ground for testing Y input from SAA9750H (CAMDSP) (MSB) Y input from SAA9750H (CAMDSP) Y input from SAA9750H (CAMDSP) Y input from SAA9750H (CAMDSP)
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
SAA9740H
60 AMSAL
57 CDS7
56 CDS6
55 CDS5
54 CDS4
53 CDS3
52 CDS2
51 CDS1
50 CDS0
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58 SCAN_T
59 VSS5
Y3 TSTIN1 TSTIN2 TSTIN3 TST1 VDD1 VSS1 UV_SEL UV0
1 2 3 4 5 6 7 8
49 VSS4 48 CLK1 47 VDD3 46 VSS3 45 TSTOUT5 44 TSTOUT4 43 TSTOUT3 42 TSTOUT2 41 TSTOUT1 40 CLK2OUT 39 TSTOUT7 38 TSTOUT6 37 LWDB 36 WDMNT 35 HSYNC 34 HD 33 VD WDINT 32
64 Y4
63 Y5
62 Y6
61 Y7
SAA9740H
9 UV1 10 UV2 11 UV3 12 UV4 13 UV5 14 UV6 15 UV7 16 WCLIP 17 VDD2 18 VSS2 19 IO7 20 IO6 21 IO5 22 IO4 23 IO3 24 IO2 25 IO1 26 IO0 27 RSTB 28 RDB 29 WRB 30 ASTB 31
MHA285
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
FUNCTIONAL DESCRIPTION The Advanced Auto Control Function (A2CF) will be used for colour CCD camera systems. The input signals are CDS (AF data) from 8-bit ADC, Y (for AE, 5-bit) and UV (for AWB, 8-bit) data as the output of SAA9750H (CAMDSP) and they are fed into the A2CF. After being processed in the A2CF, corresponding data are led into the microprocessor. Together with the zoom encoder and focus sensor output the microprocessor does the following control with the data of A2CF: * Control focus motor * Control iris, AGC (via DAC) and high speed shutter * Send the control data to SAA9750H (CAMDSP) via serial bus. CLK1 is depending on the CCD type. To cope with the different CCD clocks, some reference data have to be set by the microprocessor. AF system Fig.4 AE window.
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SAA9740H
This maximum focus value is accumulated in the AF window (see Fig.3) by the 18-bit adder. The values in the large window are stored in REG2 (see Table 7) and those in the small window are stored in REG3 (see Table 7). Which data is used is dependent on the software (see Tables 6 and 7). Besides this accumulation, line peak accumulation is also done. This data is the maximum value in one field and is stored in REG0 (see Table 7). AE system
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active video
1 2 3 5 4
MHA288
active video
large window centre window
MHA287
Fig.3 AF window.
Digital CDS signals CDS7 to CDS0 which come after AGC, gamma processing and ADC are fed into A2CF. This 8-bit data is shifted to the most suitable 6-bit data for AF processing by microprocessor. For example, when the MSB of them is `1' then the 6-bit data is shifted by the microprocessor to CDS7 to CDS2 (not CDS6 to CDS1 or CDS5 to CDS0; see Table 4). After AF shifting the signals go through an LPF and they are down sampled. The down sampling is done by CLK2 (CLK1/2). In order to detect the high frequency component for AF processing, one HPF is added. This output is the focus value. Next peak hold block is for acquiring maximum focus value of every line in one field. 1996 Oct 10 7
5-bit Y signals Y7 to Y3 which come from SAA9750H are fed into A2CF for AE processing. This signal is internally extended to 6 bits by adding a `0' as new MSB. Next they go through an LPF and they are down sampled in the same way as AF processing. In order to prevent overflow of the 18-bit adder block, 2 modes exist (see Table 4). The first is H decimation is on or off. If H decimation is on, then the data for AE processing is available in every other line. The second mode is that the data for AE processing is shifted to 12 or not. If the data is shifted to 12, it is done before down sampling and before the data going to the 18-bit adder becomes 12. Both these modes are controlled by the microprocessor. In AE mode there are 5 windows as shown in Fig.4. These windows are controlled by the microprocessor. The accumulation data in window 1 to window 5 is respectively stored in REG1 to REG5 (see Table 7). The white-clip count data in the centre window is stored to the lower 5 bits of REG0 (see Table 7). The upper 3 bits of REG0 is the overflow information in the 18-bit adder (see Table 7).
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
AWB system 8-bit UV signals UV[7] to UV[0] which come from the SAA9750H (CAMDSP) are fed into the A2CF for AWB processing. First the 8-bit data is limited to 6-bits because the necessary data for AWB processing is around the white colour signal. Then these signals go through an LPF and they are down sampled. They are separated to U and V signals by using UV_SEL coming from SAA9750H (CAMDSP). As shown in Table 1, in the large window these signals are compared with the threshold that is set by the microprocessor. If the conditions shown in Fig.8 are valid, the data is available for AWB processing. If the conditions aren't valid, the data is ignored. The available data in the first to the 4th quadrant are stored in respectively REG1 to REG4 (see Table 7). The AWB ()
SAA9740H
mode (see Table 4) is for detecting whether the picture is mono colour or not. If the AWB (B - Y) or AWB (R - Y) or AWB () (see Table 4) mode is active and white-clip or AWB limited (as mentioned above), then the counts of them are stored in the lower 5 bits of REG0 (see Table 7). In the AWB Y mode the lower 4 bits of REG0 are contrast peak data in one field and the 4th bit is the overflow information of the AF (see Table 7). Microprocessor interface 8-bit data bus and 3 control ports are prepared (WRB, RDB and ASTB) for microprocessor interface in A2CF for quick data access instead of serial bus. A2CF has 11 read commands and 13 write commands.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD Ptot VI VO Tstg Tamb Ves LTCH Note 1. Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. supply voltage total power dissipation input voltage output voltage storage temperature operating ambient temperature electrostatic handling; note 1 latch-up protection PARAMETER - -0.5 -0.5 -65 -20 -2000 100 MIN. -0.5 83 VDD + 0.5 VDD + 0.5 +150 +70 +2000 - MAX. +5.0 V mW V V C C V mA UNIT
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
DC CHARACTERISTICS Tamb = -20 to +70 C; VDD = 2.7 to 3.3 V; unless otherwise specified. SYMBOL IDD PARAMETER supply current CONDITIONS note 1 - MIN. TYP. 12
SAA9740H
MAX. 25
UNIT mA
Input pins (TSTIN1 to TSTIN3, TST1, UV_SEL, UV0 to UV7, Y3 to Y7, WCLIP, RSTB, RDB, WRB, ASTB, VD, HD, HSYNC, CLK1, CDS0 to CDS7, SCAN_T and AMSAL) VIH VIL IIH IIL VOH VOL HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current VIH = VDD VIL = VSS IOH = -20 A IOH = -4 mA LOW level output voltage IOL = +20 A IOL = +4 mA Output pins (WDMNT, LWDB and CLK2OUT; open-drain) VOL IOZ VOH VOL VIH VIL IIH IIL IOZ Note 1. 510H PAL; VDD = 3 V; all modes active. LOW level output voltage 3-state leakage current IOL = +20 A IOL = +4 mA VO = VDD IOH = -20 A IOH = -8 mA LOW level output voltage HIGH level input voltage LOW level input voltage HIGH level input current LOW level input current 3-state leakage current VIH = VDD VIL = VSS VO = VDD or VSS IOL = +20 A IOL = +8 mA Bidirectional pins (IO0 to IO7) HIGH level output voltage VDD - 0.1 - VDD - 0.5 - - - 0.7VDD - - - - - - - - - - - - - 0.1 0.5 - 0.3VDD 1 -1 5 V V V V V V A A A - - - - - - 0.1 0.5 5 V V A 0.7VDD - - - - - - - - 0.3VDD 1 -1 - - 0.1 0.5 V V A A
Output pins (WDINT and TSTOUT1 to TSTOUT7; push pull output) HIGH level output voltage VDD - 0.1 - VDD - 0.5 - - - - - V V V V
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
AC CHARACTERISTICS
SAA9740H
Microprocessor interface Tamb = -20 to +70 C; VDD = 2.7 to 3.3 V; VIL = 0 V; VIH = VDD; Vref = 0.5VDD; input tr and tf = 30 ns; see Fig.5; unless otherwise specified. SYMBOL tsuAD thAD tAR tW R tRRD thRRD tAW tW W tsuW thW PARAMETER address setup time address hold time ASTB to RDB time RDB width RDB to read data RDB to read data hold time ASTB to WRB time WRB width WRB setup time WRB hold time RL = 1 k RL = 1 k CONDITIONS MIN. 0.4 0.4 0.5 1.0 - - 0.5 1.0 0.4 0.4 - - - - - - - - - - TYP. - - - - 0.8 0.1 - - - - MAX. UNIT s s s s s s s s s s
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90% address 10% tsuAD thAD 90% tRRD thRRD read data write data
90%
VIH
IO7 to IO0
10%
VIL
VIH
ASTB
50% 10% tr tf tAR tW R VIH VIL
RDB
50%
50% VIL tsuW thW VIH
tAW
tW W
WRB
50%
50% VIL
MHA292
Fig.5 Microprocessor interface timing.
1996 Oct 10
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
SAA9740H
Data input/output timing (CLK1) Tamb = -20 to +70 C; VDD = 2.7 to 3.3 V; VIL = 0 V; VIH = VDD; Vref = 0.5VDD; tr and tf = 6 ns; output load capacitance = 20 pF; unless otherwise specified. SYMBOL tsuDI thDI tdDO thDO tW CLK1 Notes 1. Data inputs: UV0 to UV7, Y3 to Y7, AD0 to AD7, UV_SEL, HSYNC, HD, VD and WCLIP. 2. Data outputs: WDINT, CLK2OUT, WDMNT and LWDB (open-drain outputs with 1 k output load resistor). 3. Tamb = 25 C; VDD = 3.0 V. PARAMETER data input setup time data input hold time data output delay time data output hold time width of CLK1 note 1 note 1 notes 2 and 3 notes 2 and 3 CONDITIONS 5 8 - - - MIN. - - - - 50 TYP. - - 60 60 - MAX. UNIT ns ns ns ns %
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tf 90%
tW CLK1
tr 90% VIH
CLK1
Vref 10% tsuDI 90% thDI 90% VIH 10% VIL
data inputs 10% tdDO 90% data outputs 10% 10%
MHA291
10% tdDO
VIL VIH
(1)
90%
VIL
(1) 50% for open-drain outputs.
Fig.6 Data input/output timing (CLK1).
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
MICROPROCESSOR COMMANDS Table 1 Write commands; note 1 DATA COMMAND IO7 81H(2) 82H(2) 83H(2) 84H(2) 85H(2) 86H(2) 87H(2) 88H(2) 8BH 8CH 8DH 8EH 8FH Notes 1. X = don't care. X X X X X X X X X THB[3] X SFTY X X X X X X X X X TEST2 THB[2] X SFT1 SIZE IO6 IO5 X1[5] X2[5] X3[5] X4[5] Y1[5] Y2[5] Y3[5] Y4[5] TEST1 THB[1] X SFT0 MWD1 IO4 X1[4] X2[4] X3[4] X4[4] Y1[4] Y2[4] Y3[4] Y4[4] TEST0 THB[0] X X MWD0 IO3 X1[3] X2[3] X3[3] X4[3] Y1[3] Y2[3] Y3[3] Y4[3] X THA[3] THC[3] HON X IO2 X1[2] X2[2] X3[2] X4[2] Y1[2] Y2[2] Y3[2] Y4[2] IIRC2 THA[2] THC[2] MODE2 PHS IO1 X1[1] X2[1] X3[1] X4[1] Y1[1] Y2[1] Y3[1] Y4[1] IIRC1 THA[1] THC[1] MODE1 PHD IO0 X1[0] X2[0] X3[0] X4[0] Y1[0] Y2[0] Y3[0] Y4[0] IIRC0
SAA9740H
FUNCTION X1 address X2 address X3 address X4 address Y1 address Y2 address Y3 address Y4 address IIRC TH1 TH2 MODE SET
THA[0] THC[0] MODE0 PVD
2. For auto exposure processing different windows in the active video field are taken with different weighting factors. The coordinates of the five windows are set according to Fig.7. The resolution is 1 bit 16 pixel in x-direction and 1 bit 8 lines in y-direction.
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active video X3/Y3 X1/Y1 WIN2 WIN1 WIN3 WIN5 X2/Y2 X4/Y4 WIN4
MHA289
Fig.7
Window size control for AE processing (see WRITE command 81H to 88H).
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
Address 8BH Table 2 IIRC2 0 0 0 0 1 Table 3 TEST2 X Note 1. X = don't care. Address 8CH and 8DH IIRC (IO[2] to IO[0]) IIRC1 0 0 1 1 1 IIRC0 0 1 0 1 0 FUNCTION 1 MHz HPF select for auto focus processing 700 kHz HPF select for auto focus processing 220 kHz HPF select for auto focus processing bypass HPF for auto focus processing 110 kHz select for auto focus processing
SAA9740H
IIRC 9IO[6] to 9IO[4]; note 1 TEST1 X TEST0 X only for test purposes FUNCTION
Address 8CH and 8DH are used to define the active range that is taken for auto white balance processing. The calculation of active area can be seen in Fig.8.
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R-Y (V)
THB
THA -THA B-Y (U)
-THB
Conditions: (1) U + V < THA. (2) V < THB. (3) Y > THC. Threshold values can be set with 4-bit resolution.
MHA290
Fig.8 Set threshold values for Auto White Balance (AWB) mode.
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
Address 8EH
SAA9740H
By applying address 8EH and setting the MODE bits it is possible to read the values that are stored in the registers corresponding to the selected mode. The selection which register will be read is then defined by READ address 70H to 7BH (see Tables 6 and 7). Table 4 IO7 MODE and shift definition (see WRITE command 8EH); note 1 IO6 IO5 IO4 - X X X X X X X X X X X X IO3 IO2 IO1 IO0 MODE HON MODE MODE MODE X X X X X X 0 1 X X X X 0 0 0 1 1 1 0 0 0 0 0 0 0 0 1 0 0 1 0 0 0 0 0 0 0 1 1 0 1 0 0 0 1 1 1 0 AE AF set mode: read AE values set mode: read AF values FUNCTION
SFTY SFT1 SFT0 X X X X X X X X X X X 0 X X X X X X X X 0 0 1 X X X X X X X X X 0 1 X X
AWB (B - Y) set mode: read AWB (B - Y) values AWB (R - Y) set mode: read AWB (R - Y) values AWB AWB Y H dec H dec AF shift AF shift AF shift AE shift set mode: read AWB values set mode: read AWB Y values decimation for 1H off decimation for 1H on select CDS5 to CDS0 for AF processing select CDS6 to CDS1 for AF processing select CDS7 to CDS2 for AF processing take AE[5] to AE[0] for internal AE processing (see Chapter "Functional description") take AE[5] to AE[1] for internal AE processing (see Chapter "Functional description")
1
X
X
X
X
0
0
0
AE shift
Note 1. X = don't care.
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Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
Address 8FH
SAA9740H
To apply several types of CCDs it is possible to set polarity VD, HD and HSYNC by PVD, PHD and PHS. The modes set by MWD and SIZE bit are only used for system evaluation. During normal application mode they can have any value. Table 5 IO7 - X X X X X X X X X X X X Note 1. X = don't care. READ commands The values of the internal registers can be read as follows: 1. Set mode AF, AE or AWB by WRITE command 8EH according to Table 4. 2. Select register by READ command 70H to 7BH according to Table 6. Table 6 Read command DATA COMMAND IO7 70H 71H 72H 73H 74H 75H 76H 77H 78H 79H 7BH 1996 Oct 10 O[15] O[7] O[15] O[7] O[15] O[7] O[15] O[7] O[15] O[7] O[7] IO6 O[14] O[6] O[14] O[6] O[14] O[6] O[14] O[6] O[14] O[6] O[6] IO5 O[13] O[5] O[13] O[5] O[13] O[5] O[13] O[5] O[13] O[5] O[5] IO4 O[12] O[4] O[12] O[4] O[12] O[4] O[12] O[4] O[12] O[4] O[4] IO3 O[11] O[3] O[11] O[3] O[11] O[3] O[11] O[3] O[11] O[3] O[3] 15 IO2 O[10] O[2] O[10] O[2] O[10] O[2] O[10] O[2] O[10] O[2] O[2] IO1 O[9] O[1] O[9] O[1] O[9] O[1] O[9] O[1] O[9] O[1] O[1] IO0 O[8] O[0] O[8] O[0] O[8] O[0] O[8] O[0] O[8] O[0] O[0] REG0 REG5 REG4 REG3 REG2 REG1 FUNCTION Settings (see WRITE command 8FH); note 1 IO6 SIZE X X X X X X X X X X 0 1 IO5 MWD1 X X X X X X 0 0 1 1 X X IO4 MWD0 X X X X X X 0 1 0 1 X X IO3 - X X X X X X X X X X X X IO2 PHS X X X X 0 1 X X X X X X IO1 PHD X X 0 1 X X X X X X X X IO0 MODE PVD 0 1 X X X X X X X X X X PVD PVD PHD PHD PHSYNC PHSYNC MWD AE MWD AF MWD AWB MWD ALL MWD SMALL MWD LARGE VD `H' active VD `L' active HD `H' active HD `L' active HSYNC `H' active HSYNC `L' active monitor AE window monitor AF window monitor AWB window monitor all windows monitor small window monitor large window FUNCTION
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
Register assignment
SAA9740H
For the different modes (AF, AE and AWB) the contents of the registers are assigned according to Table 7. Table 7 Register assignment REGISTER REG0 (8-bit) DATA O[7] to O[5] O[4] O[3] to O[0] n.a. overflow information of AF block contrast peak within one field FUNCTION
MODE AF
REG1 (18-bit) O[15] to O[0] n.a. REG2 (18-bit) O[15] to O[0] accumulated data in the large window REG3 (18-bit) O[15] to O[0] accumulated data in the centre window REG4 (18-bit) O[15] to O[0] accumulated data of the large window minus the data of the centre window REG5 (18-bit) O[15] to O[0] n.a. AE REG0 (8-bit) O[7] to O[5] O[4] to O[0] 18-bit adder overflow information white-clip counter output
REG1 (18-bit) O[15] to O[0] accumulated data in WIN1; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated data in WIN2; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated data in WIN3; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated data in WIN4; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] accumulated data in WIN5; REG5[18] to REG5[3] AWB (B - Y) REG0 (8-bit) O[7] to O[5] O[4] to O[0] n.a. white-clip or AWB limiter count
REG1 (18-bit) O[15] to O[0] accumulated B - Y data of 1st quadrant; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated B - Y data of 2nd quadrant; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated B - Y data of 3rd quadrant; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated B - Y data of 4th quadrant; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. AWB (R - Y) REG0 (8-bit) O[7] to O[5] O[4] to O[0] n.a. white-clip or AWB limiter count
REG1 (18-bit) O[15] to O[0] accumulated R - Y data of 1st quadrant; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated R - Y data of 2nd quadrant; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated R - Y data of 3rd quadrant; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated R - Y data of 4th quadrant; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. AWB () REG0 (8-bit) O[7] to O[5] O[4] to O[0] n.a. white-clip or AWB limiter count
REG1 (18-bit) O[15] to O[0] accumulated (R - Y) data of WIN1 to WIN5; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated (B - Y) data of WIN1 to WIN5; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated (R - Y) data of WIN3; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated (B - Y) data of WIN3; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a. 1996 Oct 10 16
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
SAA9740H
MODE AWB (Y)
REGISTER REG0 (8-bit)
DATA O[7] to O[5] O[4] O[3] to O[0] n.a.
FUNCTION overflow information of auto focus block contrast peak within one field
REG1 (18-bit) O[15] to O[0] accumulated R - Y data of 1st quadrant; REG1[18] to REG1[3] REG2 (18-bit) O[15] to O[0] accumulated R - Y data of 2nd quadrant; REG2[18] to REG2[3] REG3 (18-bit) O[15] to O[0] accumulated R - Y data of 3rd quadrant; REG3[18] to REG3[3] REG4 (18-bit) O[15] to O[0] accumulated R - Y data of 4th quadrant; REG4[18] to REG4[3] REG5 (18-bit) O[15] to O[0] n.a.
1996 Oct 10
17
1996 Oct 10
handbook, full pagewidth
APPLICATION INFORMATION
Philips Semiconductors
Advanced Auto Control Function (A2CF)
CAMERA
zoom encoder
focus sensor
hall sensor
Y LPF clamp CAMDSP CDS AGC, GAMMA AGC ADC 8-bit SIGNAL PROCESS Y/C SEPARATION SSG ENCODER Y (8-bit) UV (8-bit) BPF C
CCD
HD, VD zoom lens focus lens iris PPG D/A UV_SEL HSYNC WCLIP
SAA9750H
serial data bus UV7 to UV0 Y7 to Y3
ADC
18
high speed shuffle control MOTOR DRIVER MOTOR DRIVER IRIS DRIVER CDS7 to CDS0
MICROPROCESSOR A2CF AF/AE/AWB
SAA9740H
IO7 to IO0 3
MHA293
Product specification
SAA9740H
Fig.9 Camera block diagram (SAA9750H and SAA9740H).
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
PACKAGE OUTLINE LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SAA9740H
SOT314-2
c
y X A 48 49 33 32 ZE
e E HE wM bp 64 1 pin 1 index 16 ZD bp D HD wM B vM B vM A 17 detail X L Lp A A2 A1 (A 3)
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.5 HD HE L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7 0o
o
12.15 12.15 11.85 11.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT314-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-01
1996 Oct 10
19
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
SAA9740H
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Oct 10
20
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
SAA9740H
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Oct 10
21
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
NOTES
SAA9740H
1996 Oct 10
22
Philips Semiconductors
Product specification
Advanced Auto Control Function (A2CF)
NOTES
SAA9740H
1996 Oct 10
23
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1200/02/pp24
Date of release: 1996 Oct 10
Document order number:
9397 750 01158

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